Encapsulation method developed for OLED devices mounted at laboratory

Abstract

A simple method with low cost of encapsulation for organic light emitting diode (OLED) devices mounted at laboratory was proposed to obtain considerable increase of the lifetime. In this study, it was used a capsule formed by: glass slide as substrate, a layer of polyvinyl acetate glue diluted in methyl alcohol, a layer of calcium oxide as secant and epoxy placed at the edges of capsule. The performance of this capsule was analyzed using a thin film of polymer semiconductor called as PEDOT:PSS, that is sensitive to moisture and oxygen from atmospheric air. The PEDOT:PSS thin layer was deposited between anode and cathode electrodes using commercial indium tin oxide (ITO) thin film deposited on glass substrate. The capsule was placed covering completely the PEDOT:PSS thin film, and the electrical resistance was measured by elapsed days. This result revealed lowest electrical resistance compared with other methods, showing also good performance as encapsulation process.