We are performing tests of adhesion between silicon samples prepared by wet chemical baths, and argon and oxygen plasmas, with the aim of optimizing the adhesion before the annealing step of fusion bonding. The bonded arca is monitored and measured by imaging with transmitted infrared light. The disbonding pressure is measured in a tensile-test machine. We obtained interfaces with no large voids over the whole sample arca and pairs with disbonding pressures of 0.2 MPa, for samples prepared by activation in a NH40H-H202-H20 bath.
