As the microelectronic industry enters the era of a very large scale integration VLSI) of circuit, “submicron structure” is a subject of considerable current scientific research. The so-called “submicron structure” is the measure of lateral and vertical dimensions of circuit units such as contacts, gates and interconnecting lines made mostly of METALLIC FILMS on semiconductors. In submicrom structure research the question most often being asked, aside from how to make them, is WHAT ARE THE FUTURE MATERIALS PROBLEMS IN THESE SUBMICRON THIN FILM STRUCTURES?
